Thread: Ivy Bridge provides heat conduction problems when overclocking

Intel's third generation of processors in overclocking Ivy Bridge can still unsatisfactory. Responsible for this are the high temperatures of the CPU, which are caused by a new production technology.


Intel's Ivy Bridge is the third generation of Core i processors. Were the predecessors of the Sandy Bridge series is still partly true overclocking artist, the situation is completely different from the new CPUs dar. What's colleagues sites want to have now found a new production technology for high temperatures processor responsible.


Taking apart the CPU, thus disconnecting the Integrated Heat Spreader of the CPU, the inventors have discovered a layer of heat conduction. In models of past series, the IHS was soldered. The heat of the processor is thus fed via the heat conduction to the IHS, whereby only one other layer must be overcome. Why Intel is in the production of the new CPUs on this method is not known. With a direct connection between the CPU IHS and the thermal conductivity will be 80 watts per meter and Kelvin (W / mK). The heat conduction is estimated to be 5 W / mK.




Although Ivy Brdige chips are fabricated in a 22nm process, which leads to smaller CPUs, and the higher heat density is not the reason for the worse overclocking potential and temperature differences of up to 30 degrees Celsius. For comparison, a Sandy Bridge processor gets warm at a clock speed of 4.5 GHz according Overclockers 60 degrees Celsius. Ivy Bridge, however, reached 80 to 90 degrees Celsius.


How does generate TIM paste solder for fluxless rally compare with conducting heat? Heat conductivity can be measured in watts per meter Kelvin. To be technically exact, we would need to know exactly what Intel is using for TIM / paste solder. When I went to Intel and asked, not their polite answer may surprise you - "Secret Sauce"! Given that, we can use some rough approximations. A solder attach could have a heat conductivity in the range of 80 W / mK. A TIM paste could have a heat conductivity in the range of 5 W / mK. That's your problem right there! Note that these values are not exact, as we do not know the exact heat conductivity of Intel's "secret sauce".


However, these values are representative of solder paste or TIM, and there is a giant gap between how TIM paste and solder perform in regards to conducting heat. They are in different leagues.